Wet Robot

Wafer Transfer

Robots and Design's Wet Robot is specially designed for semiconductor wet processing environments. Featuring bellows protection and Teflon coating throughout, it withstands corrosive chemicals and high-humidity conditions while maintaining precise wafer handling performance. Ideal for wet cleaning, etching, and chemical bath applications.

Designed to use in wet/humid condition
Use of bellows and Teflon coated body with cover
Highly sealed mechanical structure

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Specification
	TYPE 1	TYPE 2 (Cartesian Z)
Motion Range
R1,R2 axis (Extension)	645 mm	680 mm
T axis (Rotation)	330 deg	330 deg
Z axis (Up/down)	300 mm	1255 mm
X axis (Traverse) Optional	○	○
Performance - Max Speed
R1,R2 axis (Extension)	247 deg/sec	275 deg/sec
T axis (Rotation)	211 deg/sec	188 deg/sec
Z axis (Up/down)	500 mm/sec	500 mm/sec
X axis (Traverse)	1000 mm/sec	1000 mm/sec
Repeatability
R1,R2 axis (Extension)	±0.1 mm	±0.1 mm
T axis (Rotation)	±0.05 deg	±0.05 deg
Z axis (Up/down)	±0.1 mm	±0.1 mm
X axis (Traverse)	±0.1 mm	±0.1 mm

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