Vacuum

Vacuum Robot

Robots and Design's Vacuum Robot is optimized for ultra-high vacuum environments (1E-6Pa). All axes are equipped with servo motors, and magnetic fluid seals are used for vacuum compatibility. The rotation diameter is minimized while extension is maximized.

  • Minimizing rotation diameter and maximizing extension
  • Magnetic fluid sealing
  • Servo motor for all axes
  • Used for 1E-6Pa vacuum environment
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Vacuum Robot — Specification
Branch StructureBoomerang Structure
Motion Range
R1,R2 axis (Extension)1100 mm800 mm
T axis (Rotation)±185 deg at origin position±185 deg at origin position
Z axis (Up/down)0~+104 mm0~+104 mm
Performance - Max Speed
R1,R2 axis (Extension)120 deg/sec240 deg/sec
T axis (Rotation)120 deg/sec240 deg/sec
Z axis (Up/down)42 mm/sec42 mm/sec
Repeatability
R1,R2 axis (Extension)±0.1 mm±0.1 mm
Z axis (Up/down)±0.05 mm±0.05 mm
General
Wafer Size12" wafer12" wafer
Control Axis44
Arm TypeDual ArmDual Arm
Blade Thickness≤ 3mm≤ 3mm
Load Capacity1.5 kg1.5 kg
Cable Length (Robot - Controller)3m (Standard)3m (Standard)
Power (Controller)Single Phase AC208V ±10%, 5ASingle Phase AC208V ±10%, 5A
CommunicationRS232CRS232C
Operating PressureAtmospheric pressure~10−6 PaAtmospheric pressure~10−6 Pa
Load Lock Chamber
Vacuum Application

Load Lock Chamber

The Load Lock Chamber controls the vacuum when transferring wafers in and out between vacuum chambers and atmospheric equipment (EFEM).

  • 2 or 1 shelf pass-through chamber (loading/unloading)
  • 4 view points
  • Auto door open structure
  • Included wafer slide out detection sensor
  • Control the vacuum when transferring wafer in/out from vacuum chamber and atmospheric equipment (EFEM)
TM Chamber
Vacuum Application

TM Chamber

The Transfer Module Chamber integrates a vacuum robot with multiple side ports for process module connections, with comprehensive wafer detection sensors.

  • 7 sides for 6 PMs, 1 Load Lock integrated
  • Vacuum Robot integrated
  • Wafer detection sensor, wafer slide out detection sensor, wafer presence sensor installed
  • 6 view points
Cluster Tool
Vacuum Application

Cluster Tool

A complete vacuum processing system integrating EFEM, Load Lock, and TM Chamber for 300mm wafer processing with dual arm vacuum robot.

  • Up to 7 sides for 5 PMs TM Chamber for 300mm Wafer
  • 2 slots of L/L chamber
  • Load lock options: 2 wafer pass-through
  • 2 wafer with cooling and pre-heat
  • 26-wafer batch or 13-wafer batch with cooling
  • Dual Arm Vacuum Robot
  • Vacuum Pumping system
  • SEMI compliance
Cluster Tool — Specification
Cluster Tool
General Info
Wafer Size300 mm
ConfigurationEFEM, Load Lock, TM Chamber
Dimension1,180(W) × 1,190(D) × 1,190(H)
ValveVacuum Slot Valve
LIPManual Gear Type
Passline1,100 mm
Utility
Vacuum1×10E-2 ~ 5×10E-2
VentNitrogen
PCWNominal 40 Psi
CDA5 kg/cm²

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