Telescopic WTR

Wafer Transfer

Robots and Design's Telescopic WTR is a 3-step telescopic type robot equipped with a maximum vertical stroke of 1200mm, covering a wide work range. Single/dual arm configurations are available, transferring 300mm wafers quickly and precisely in Class 1 cleanroom environments.

*Optional: Linear Track, Mapping Sensor

Maximum 1,200mm vertical stroke (Z-stroke)
Up to 3-step telescopic type
ODM or OEM Supply
Dual arm / Multi Blade Type
Fast & Precise Motion Robot
0.1 micron meter CLASS 1 Cleanliness
Various End-Effector: Vacuum Blade, Edge Gripper
Linear Track, Wafer mapping sensor (Optional)
Customization available when requested

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Specification
	Tele Single (2-Step)	Tele Dual (2-Step)	Tele Single (3-Step)	Tele Dual (3-Step)
Motion Range
R1,R2 axis (Extension)	651 mm	651 mm	651 mm	651 mm
T axis (Rotation)	330 deg	330 deg	330 deg	330 deg
Z axis (Up/down)	1,050 mm	1,050 mm	1,200 mm	1,200 mm
Performance - Max Speed
R1,R2 axis (Extension)	360 deg/sec	360 deg/sec	360 deg/sec	360 deg/sec
T axis (Rotation)	256 deg/sec	256 deg/sec	196 deg/sec	196 deg/sec
Z axis (Up/down)	600+600 mm/sec		400+400+400 mm/sec
Repeatability
R1,R2 axis (Extension)	±0.1 mm	±0.1 mm	±0.1 mm	±0.1 mm
T axis (Rotation)	±0.02 deg	±0.02 deg	±0.02 deg	±0.02 deg
Z axis (Up/down)	±0.1 mm	±0.1 mm	±0.1 mm	±0.1 mm
General
Wafer Size	8~12 inch
Control Axis	4	5	5	6
Arm Type	Single Arm	Dual Arm	Single Arm	Dual Arm
Blade Thickness	≤ 3mm
Cleanliness	Class 1 @ 0.1µm
Load Capacity	1 kgf (Including Gripper)
Weight	80 kgf	80 kgf	110 kgf	110 kgf
Cable Length (Robot - Controller)	3m (Standard)
Power (Controller)	Single Phase AC220V ±10%, 10A
Air	More than 0.4~0.5MPa, Φ4mm
Vacuum	Less than -50 kPa
Operating Temp.	0~40 °C

Telescopic WTR

Telescopic WTR

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