Aligner

Module

Robots and Design's Aligner modules include CCD Aligners (XYR type and XZR type) and Edge Grip Aligners, supporting 2-12 inch wafers. With centering accuracy of ±0.1mm, these modules ensure precise wafer pre-alignment before processing steps. The CCD-based systems provide non-contact alignment while edge grip types offer reliable mechanical positioning.

Controller integrated compact design
High accuracy and reliable repeatability
Compatible with 200mm/300mm wafer without mechanical change (Edge grip type only for 300mm)

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Specification — CCD Aligner (XYR Type)
	CCD (XYR TYPE)
General
Axes	3
Handling Wafer	8~12 inch
Body Dimension (W)	320 mm
Body Dimension (D)	230 mm
Body Dimension (H)	210 mm
Weight	About 10 kg
Accuracy
Center Offset	±5 mm
Centering	±0.1 mm
Rotation	±0.1 deg
Alignment Time	≤4 sec
Utility
Power	24V DC ±10%, 5A
Vacuum	Less than -80 kPa
Communication	RS232C

Specification — CCD Aligner (XZR Type)
	CCD (XZR TYPE)
General
Axes	3
Handling Wafer	2~8 inch
Body Dimension (W)	305 mm
Body Dimension (D)	200 mm
Body Dimension (H)	248 mm
Weight	About 10 kg
Accuracy
Center Offset	±5 mm
Centering	±0.1 mm
Rotation	±0.1 deg
Alignment Time	≤6 sec
Utility
Power	24V DC ±10%, 5A
Vacuum	Less than -80 kPa
Communication	RS232C

Specification — CCD Aligner (Warpage Type)
	CCD (Warpage)
General
Axes	3
Handling Wafer	8~12 inch (for warpage wafer)
Body Dimension (W)	290 mm
Body Dimension (D)	250 mm
Body Dimension (H)	237 mm
Weight	About 12 kg
Accuracy
Center Offset	±5 mm
Centering	±0.1 mm
Rotation	±0.1 deg
Alignment Time	≤7 sec
Utility
Power	24V DC ±10%, 5A
Vacuum	Less than -80 kPa
Communication	RS232C

Specification — Edge Grip Aligner
	Edge Grip Type
General
Axes	3
Handling Wafer	12 inch
Body Dimension (W)	260 mm
Body Dimension (D)	260 mm
Body Dimension (H)	305 mm
Weight	About 15 kg
Accuracy
Center Offset	±1.5 mm
Centering	±0.1 mm
Rotation	±0.2 deg
Alignment Time	≤9 sec
Utility
Power	24V DC ±10%, 4A Max
Communication	RS232C

Aligner

Aligner

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