Clean robot handling 18 inch wafers with 2-step Z axis and advanced motion control.
Robots and Design's 18 inch Wafer Transfer Robot is a clean robot designed for handling 18 inch wafers. It features a 2-step Z axis, advanced motion control system, and high rigidity with lower vibration for precise large-format wafer transfer.
| Parameter | Single Arm | Dual Arm | |
|---|---|---|---|
| Motion Range | |||
| R1,R2 axis (Extension) | 885 mm | 885 mm | |
| T axis (Rotation) | 330 deg | 330 deg | |
| Z axis (Up/down) | 600 mm | 600 mm | |
| Max Speed | |||
| R1,R2 axis (Extension) | 360 deg/sec | 360 deg/sec | |
| T axis (Rotation) | 211 mm/sec | 211 mm/sec | |
| Z axis (Up/down) | 500 mm/sec | 500 mm/sec | |
| Repeatability | |||
| R1,R2 axis (Extension) | ±0.1 mm | ±0.1 mm | |
| T axis (Rotation) | ±0.02 deg | ±0.02 deg | |
| Z axis (Up/down) | ±0.1 mm | ±0.1 mm | |
| General | |||
| Wafer Size | 8~18" | ||
| Control Axis | 4 | 5 | |
| Arm Type | Single Arm | Dual Arm | |
| Blade Thickness | ≤ 3mm | ||
| Cleanliness | Class 1 @ 0.1µm | ||
| Load Capacity | 1 kgf (Including Gripper) | ||
| Cable Length (Robot - Controller) | 3m (Standard) | ||
| Power (Controller) | Single Phase AC208 ±10%, 50/60Hz | ||
| Air | More than 0.4~0.5MPa, Φ4mm | ||
| Vacuum | Less than -50 kPa | ||
| Operating Temp. | 0~40 °C | ||
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