:::::::: Robots and Design Co., Ltd. ::::::::::
 
 
:: :: Semiconductor :: Semiconductor Robot
 
  [Wet Robot] Overhang Robot
  ۾ : master     ¥ : 00-00-00 00:00     ȸ : 4434    

  •  Specialized Robot for CMP(Chemical Mechanical Planarization) process
  • Upside hanging robot handling 300 mm Wafer

    • Maximum 875 mm of  R-axis extension

    • Z axis extends from top to bottom

    • 190 deg of flipping hand

    • Wafer Gripping Method: Edge Grip

    • Customization available when requested

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            Item

            Specfication

            Carrying Object

            300mm Wafer

            End-effectors

            Ceramic (Edge Grip)

            Controlled Axis

            4 Axis

            Arm Type

            Single arm

            Motion Range

            R-Axis (Extenstion)

            875 mm (Stroke : 710mm)

            -Axis (Rotation)

            330 deg

            Z-Axis (Up/Down)

            550 mm

            W-Axis (Flipping)

            190 deg

            Repeatability

            R-Axis (Extenstion)

            0.1 mm

            -Axis (Rotation)

            0.05 deg

            Z-Axis (Up/Down)

            0.05 mm

            W-Axis (Flipping)

            0.1 deg

            Maximum Speed

            R-Axis (Extenstion)

            400 mm / sec

            -Axis (Rotation)

            180 deg/set

            Z-Axis (Up/Down)

            300 mm/sec

            W-Axis (Flipping)

            180 deg/sec

            Minimum Rotation Diameter

            640 mm

            Cleanliness

            ISO class 10

            Payload

            0.8 kg

            Utility

            Power

            AC220V 10% 15A

            Vacuum

             -50kPa or more

            Weight

            Approx. 70kgf



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